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IRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14L
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
FEATURES
? Halogen-free According to IEC 61249-2-21
V DS (V)
R DS(on) ( ? )
V GS = - 10 V
- 60
0.50
Definition
? Advanced Process Technology
? Surface Mount (IRF9Z14S, SiHF9Z14S)
Q g (Max.) (nC)
Q gs (nC)
Q gd (nC)
Configuration
12
3.8
5.1
Single
? Low-Profile Through-Hole (IRF9Z14L, SiHF9Z14L)
? 175 °C Operating Temperature
? Fast Switching
? P-Channel
? Fully Avalanche Rated
? Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay utilize
advanced processing techniques to achieve extremely low
I 2 PAK (TO-262)
D 2 PAK (TO-263)
S
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a
G
D
S
G
D
S
G
wide variety of applications.
The D 2 PAK is a surface mount power package capable of
accommodating die size up to HEX-4. It provides the
highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D 2 PAK is suitable for high current applications because of is
D
P-Channel MOSFET
low internal connection resistance and can dissipate up to
2.0 W in a typical surface mount application.
The through-hole version (IRF9Z14L, SiHF9Z14L) is
available for low-profile applications.
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
D 2 PAK (TO-263)
SiHF9Z14S-GE3
IRF9Z14SPbF
SiHF9Z14S-E3
D 2 PAK (TO-263)
SiHF9Z14STRL-GE3 a
IRF9Z14STRLPbF a
SiHF9Z14STL-E3 a
I 2 PAK (TO-262)
SiHF9Z14L-GE3
IRF9Z14LPbF
SiHF9Z14L-E3
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (T C = 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
V DS
V GS
LIMIT
- 60
± 20
UNIT
V
Continuous Drain Current e
Current a, e
Pulsed Drain
V GS at - 10 V
T C = 25 °C
T C = 100 °C
I D
I DM
- 6.7
- 4.7
- 27
A
Linear Derating Factor
0.29
W/°C
Single Pulse Avalanche Energy b, e
Avalanche Current a
Repetiitive Avalanche Energy a
E AS
I AR
E AR
140
- 6.7
4.3
mJ
A
mJ
Maximum Power Dissipation
T C = 25 °C
T A = 25 °C
P D
43
3.7
W
Peak Diode Recovery
dV/dt c, e
dV/dt
- 4.5
V/ns
Operating Junction and Storage Temperature Range T J , T stg
Soldering Recommendations (Peak Temperature) for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V DD = - 25 V, starting T J = 25 °C, L = 3.6 mH, R g = 25 ? , I AS = - 6.7 A (see fig. 12).
c. I SD ? - 6.7 A, dI/dt ? 90 A/μs, V DD ? V DS , T J ? 175 °C.
d. 1.6 mm from case.
e. Uses IRF9Z14, SiHF9Z14 data and test conditions.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91089
S11-1052-Rev. C, 30-May-11
- 55 to + 175
300 d
°C
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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